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Technical Specifications
Package：Tray
Product Status：Obsolete
Architecture：MCU, FPGA
Core Processor：ARM® Cortex®-M3
Flash Size：128KB
RAM Size：16KB
Peripherals：DMA, POR, WDT
Connectivity：EBI/EMI, I2C, SPI, UART/USART
Speed：100MHz
Primary Attributes：ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature：-40°C ~ 100°C (TJ)
Grade：-
Qualification：-
Package / Case：256-LBGA
Supplier Device Package：256-FPBGA (17x17)