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📦 Stock: 988,131
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Technical Specifications
Package：Bulk
Product Status：Active
Type：SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid)：44 (2 x 22)
Pitch - Mating：-
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：20.0µin (0.51µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：0.050" (1.27mm)
Contact Finish - Post：Gold
Contact Finish Thickness - Post：20.0µin (0.51µm)
Contact Material - Post：Beryllium Copper
Housing Material：Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature：-