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📦 Stock: 508,678
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Technical Specifications
Series：-
Package：Bulk
Product Status：Obsolete
Type：SIP
Number of Positions or Pins (Grid)：20 (1 x 20)
Pitch - Mating：0.100" (2.54mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：0.100" (2.54mm)
Contact Finish - Post：Tin-Lead
Contact Finish Thickness - Post：30.0µin (0.76µm)
Contact Material - Post：Beryllium Copper
Housing Material：Thermoplastic, Polyester
Operating Temperature：-55°C ~ 125°C