Loading...
📦 Stock: 624,440
Need more? Contact us
✓ In Stock
Technical Specifications
Package：Bulk
Product Status：Active
Type：DIP, ZIF (ZIP)
Number of Positions or Pins (Grid)：90 (2 x 45)
Pitch - Mating：0.070" (1.78mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：0.070" (1.78mm)
Contact Finish - Post：Gold
Contact Finish Thickness - Post：30.0µin (0.76µm)
Contact Material - Post：Beryllium Copper
Housing Material：Polysulfone (PSU), Glass Filled
Operating Temperature：-55°C ~ 125°C