Loading...
📦 Stock: 804,568
Need more? Contact us
✓ In Stock
Technical Specifications
Package：Bulk
Product Status：Active
Type：SOIC
Number of Positions or Pins (Grid)：28 (2 x 14)
Pitch - Mating：-
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：-
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：-
Contact Finish - Post：Gold
Contact Finish Thickness - Post：30.0µin (0.76µm)
Contact Material - Post：Beryllium Copper
Housing Material：Polyethersulfone (PES), Glass Filled
Operating Temperature：-55°C ~ 150°C