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📦 Stock: 372,490
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Technical Specifications
Package：Bulk
Product Status：Obsolete
Type：QFP
Number of Positions or Pins (Grid)：100 (4 x 25)
Pitch - Mating：-
Contact Finish - Mating：Tin-Lead
Contact Finish Thickness - Mating：200.0µin (5.08µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Open Frame
Termination：Solder
Pitch - Post：-
Contact Finish - Post：Tin-Lead
Contact Finish Thickness - Post：200.0µin (5.08µm)
Contact Material - Post：Beryllium Copper
Housing Material：Polyethersulfone (PES), Glass Filled
Operating Temperature：0°C ~ 105°C