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📦 Stock: 565,933
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Technical Specifications
Series：-
Package：Tray
Product Status：Obsolete
Type：PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)：370 (19 x 19)
Pitch - Mating：0.100" (2.54mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Material - Mating：Copper Alloy
Mounting Type：Through Hole
Features：Open Frame
Termination：Solder
Pitch - Post：0.100" (2.54mm)
Contact Finish - Post：Gold
Contact Finish Thickness - Post：30.0µin (0.76µm)
Contact Material - Post：Copper Alloy
Housing Material：Liquid Crystal Polymer (LCP)
Operating Temperature：-