Loading...
📦 Stock: 272,588
Need more? Contact us
✓ In Stock
Technical Specifications
Package：Tray
Product Status：Obsolete
Type：SIP
Number of Positions or Pins (Grid)：8 (1 x 8)
Pitch - Mating：0.100" (2.54mm)
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Material - Mating：Beryllium Copper
Mounting Type：Through Hole
Features：Closed Frame
Termination：Solder
Pitch - Post：0.100" (2.54mm)
Contact Finish - Post：Gold
Contact Finish Thickness - Post：30.0µin (0.76µm)
Contact Material - Post：Beryllium Copper
Housing Material：Thermoplastic, Glass Filled
Operating Temperature：-55°C ~ 125°C